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Extending
Semiconductor Lithography Using
Image Process Integration
This course teaches methods to extend optical lithography to the 65 nm technology node using Image Process Integration (IPI). IPI is the science of choosing the proper combination of masks (including optical proximity correction), exposure tool, illuminator design, and photoresist to provide focus-exposure process windows large enough to use in a manufacturing environment. To maximize return on investment, the design of the photoresist and the exposure tool is used to simplify reticle design as much as possible. Simulation and experiment are combined to form predictions of production resolution, and recommendations are given to make these predictions a reality.
This course is now being offered by PTI Seminars Inc. as Advanced Topics in Lithography. Check out our course schedule for locations and dates.
Course Outline
Introduction to Image Process Integration (IPI)
Image Process Integration Components
- Exposure Tool
- Imaging Overview
- Off-Axis Illumination
- Layout and Design
- Mask
- Phase-Shifting Masks
- Optical Proximity Correction (OPC)
- Alternating PSMs
- Resist Process
- Chemistry Overview
- Resist Modeling
- Optimizing Thickness and Reflection
- Hot Plates as Exposure Tools
- Develop Process Considerations
Image Process Integration Examples
- Improving Process Window for Dense and Isolated Lines
- Optimizing Contact Holes
- Attacking Aberrations
- Reducing Mask Error Enhancement Factor (MEEF)
Image Process Integration Conclusions
To attend this course, contact:
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